pps-1 series 1 watt performance, standard 2010 footprint flat ceramic package 0r1 to 348k range low inductance superior surge handling capability 150? maximum operating temperature flameproof ceramic package provides superior temperature rise profile general note welwyn components reserves the right to make changes in product specification without notice or liability. all information is subject to welwyn s own data and is considered accurate at time of going to print. ?welwyn components limited ?bedlington, northumberland ne22 7aa, uk telephone: +44 (0) 1670 822181 ?facsimile: +44 (0) 1670 829465 ?email: info@welwyn-tt.com ?website: www.welwyn-tt.com electrical data issue c ?04.03 a subsidiary of tt electronics plc welwyn components pps-1 industry footprint 2010 maximum power rating at 70? watts 1 working voltage 1 volts 350 maximum voltage volts 700 resistance range ohms 0.1 to 0.99 1.0 to 348k tolerance ? 2 1, 2, 5 1, 2, 5 tcr ppm/? 2 100 50, 100 49 1 not to exceed (pxr) 1 / 2 2 consult factory for tighter tolerance or tcr physical data dimensions (mm) abcde f pps-1 4.32 ?.25 3.30 ?.13 2.01 ?.15 5.08 ?.25 3.30 ?.13 2.67 ?.13 a d b c e f pps-1 applications the pps-1 will dissipate 1 watt at 70? on a 2010 footprint. the pps-1 is recommended for applications where board real estate or component/board tce mismatch is a major concern. it is also recommended in circuits where a standard 2010 resistor exhibits marginal or unacceptable performance due to high power density/surge handling demands. top view side view metal glaze power pack surface mount high power density ceramic package pps-1_c.qxd 28/4/03 10:06 am page 1
metal glaze power pack surface mount high power density ceramic package pps-1 series ?welwyn components limited bedlington, northumberland ne22 7aa, uk telephone: +44 (0) 1670 822181 ?facsimile: +44 (0) 1670 829465 ?email: info@welwyn-tt.com ?website: www.welwyn-tt.com issue c ?04.03 welwyn components 50 performance data test method maximum change temperature coefficient mil-r-55342e par 4.7.9 (-55? +125?) as specified above thermal shock mil-r-55342e par 4.7.3 (-65? +150?, 5 cycles) ?0.5% +0.01 ohm) low temperature mil-r-55342e par 4.7.4 (-65? @ working voltage) ?0.25% +0.01 ohm) short time overload mil-r55342e par 4.7.5 (2.5 x (pxr)1/2) ?1.0% +0.01 ohm) high temperature exposure mil-r55342e par 4.7.6 (+150? for 100 hours) ?0.5% +0.01 ohm) resistance to bonding exposure mil-r55342e par 4.7.7 ?0.5% +0.01 ohm) (reflow soldered to board at 260? for 10 sec.) solderability mil-std-202, method 208 (245? for 5 seconds) 95% minimum coverage moisture resistance mil-r55342e par 4.7.8 (10 cycles, total 2240 hours) ?0.5% +0.01 ohm) life test mil-r55342e par 4.7.10 (2000 hours at 70? intermittent ?1.0% +0.01 ohm) terminal adhesion strength 1200 gram push from underside of mounted chip for 60 seconds ?1% +0.01 ohm) resistance to board bending chip mounted in centre of 90mm long board deflected 5mm so as to extent pull on chip contacts for 10 seconds +(1% +0.01 ohm) pps-1_c.qxd 28/4/03 10:06 am page 2
|
